新製品
New Product
2020/06/19
World-first Automotive SoC Type Bluetooth® Low Energy Module
Hosiden has developed a world first SoC type Bluetooth LE module, HRM3012, for automotive applications. This SoC (System on Chip) employs the CC2642R-Q1 manufactured by Texas Instruments, which enables embedding of various applications without the need of a host CPU. The unit features a 48MHz ARM® Cortex®-M4F processor and 352 KB of flash ROM. All the electrical parts mounted, including SoC have acquired certification from AEC (Automotive Electronics Council), and the module is subject to the development/manufacturing process control compliant to IATF16949, which is the global quality management system standard for the automotive industry. Such high product quality, along with its wide operating temperature range of -40 to +105℃, has allowed the product to enter a versatile scene of automotive applications. The module incorporates a high performance pattern antenna backed by a technological expertise in consumer products of more than 20 years, ensuring stable communication quality from its compact body. This product has acquired Bluetooth Version 5.1 certification, and also supports the long range and 2M modes introduced in Bluetooth 5.0. The product has also acquired radio communication certifications from Japan and Canada. The module utilizes an edge-face through-hole format, enabling simple checking of the soldering after mounting to the main board.
More and more Bluetooth LE devices will be installed in vehicles in the future, and will include such capabilities as linking to smartphones, Smart Key and fault diagnosis, or will supplant cables for in-vehicle communications. In launching Bluetooth LE products in automotive markets, we are confidently introducing our HRM3012 as an optimum module that will realize your timely and smooth marketing and release, with features such as reduced development load with high-performance antennas, assured manufacturing quality from the edge-face through-hole format, and recognized radio frequency certification.
More and more Bluetooth LE devices will be installed in vehicles in the future, and will include such capabilities as linking to smartphones, Smart Key and fault diagnosis, or will supplant cables for in-vehicle communications. In launching Bluetooth LE products in automotive markets, we are confidently introducing our HRM3012 as an optimum module that will realize your timely and smooth marketing and release, with features such as reduced development load with high-performance antennas, assured manufacturing quality from the edge-face through-hole format, and recognized radio frequency certification.
Model Name and Number
Automotive Bluetooth® Low Energy module・ＨＲＭ３０１２
Typical Features
- High reliability of AEC certified components, IATF16949 compliant process
- Stable communication using high performance antenna
- Wide operating temperature range of -40 to +105℃
- High performance CPU with low power consumption
Applications
- Smart Keys
- Fault diagnostic tool
- Bluetooth LE communication with Smartphones
Sales Plan
| Sample Production | July 2020 |
|---|---|
| Sale Start | August 2020 |
| Planned Monthly Production | 50,000 pcs |
| Sample price | 4,000JPY |
Specifications
| Item | Specification |
|---|---|
| Item | Specification |
| Bluetooth version | 5.1 |
| Memory | 256kB ROM / 352 kB Flash / 80 kB SRAM |
| Power voltage | 1.8 to 3.63V |
| Operating temperature range | -40 to 105℃ |
| Antenna | Incorporated |
| External dimensions | 12.5 x 20.0 x 2.9 mm |
| Max. number of GPIO | 14 terminals |
| Implementation | SMT (23 terminals, edge-face through hole) |
The word mark and logo of Bluetooth® is the registered trademark of Bluetooth SIG, Inc.
ARM® Cortex® is the registered trademark or the trademark of ARM Ltd. in USA and other countries.
